Product
Electronic Material
Silver coated Copper powder
Conductive powder coated with Ag with excellent anti-oxyditation and conductivity on surface of Cu powder
Application
- EMI Sheilding Mateilals (Film & Paste)
- Conductive Paste
- Instead of Ag powder
Specification
- Excllent Conductivtiy
- High Reliability
- Uniform Dispersion
Properties
Product name | Particle shape | Particle size (D50, ㎛) |
Tap dinsity (g/cc) |
Ag coating contents (%) |
---|---|---|---|---|
EN-SCD050 | Dendrite | 5.0±1.0 | 1.0~2.0 | 5~10 |
EN-SCD080 | Dendrite | 7.5±2.0 | 1.0~2.0 | 5~10 |
EN-SCD120 | Dendrite | 12.0±2.0 | 1.0~2.0 | 5~10 |
* 1) Tap density : According to Ag contensts and particle size * 2) Ag contents : Accoding to customer request
Nickel coated Polymer powder
Conductive powder coated with nickel on nonconductive polymer particle surface
Application
- Conductive Adhesive
- Conductive Gasket
- EMI Shielidng Paint
Specification
- Good conducivity
- High Reliability
- Low density
Properties
Product name | Particle shape | Particle size (D50, ㎛) |
Tap dinsity (g/cc) |
Ni coating contents (%) |
---|---|---|---|---|
EN-NPH300 | Hollow | 32±5 | 0.2~0.4 | 20~40 |
EN-NPH600 | Hollow | 65±10 | 0.2~0.4 | 20~40 |
EN-NPP050 | Filled | 7±1 | 0.9~1.1 | 60~80 |
EN-NPP100 | Filled | 10±2 | 0.9~1.1 | 60~80 |
EN-NPP200 | Filled | 20±2 | 0.9~1.1 | 60~80 |
* 1) Tap density : According to Ni contensts and particle size * 2) Ag contents : Accoding to customer request