Product
Electronic Material
Silver coated Copper powder
Conductive powder coated with Ag with excellent anti-oxyditation and conductivity on surface of Cu powder
Application
- EMI Sheilding Mateilals (Film & Paste)
- Conductive Paste
- Instead of Ag powder
Specification
- Excllent Conductivtiy
- High Reliability
- Uniform Dispersion
Properties
Product name | Particle shape | Particle size (D50, ㎛) |
Tap dinsity (g/cc) |
Ag coating contents (%) |
---|---|---|---|---|
EN-SCF030 | Flake | 3.5±0.5 | 2.0~3.5 | 5~30 |
EN-SCF040 | Flake | 4.5±0.5 | 2.0~3.5 | 5~30 |
EN-SCF070 | Flake | 7.5±0.5 | 2.0~3.5 | 5~30 |
EN-SCF080 | Flake | 8.5±0.5 | 2.0~3.5 | 5~30 |
* 1) Tap density : According to Ag contensts and particle size * 2) Ag contents : Accoding to customer request
Nickel coated Polymer powder
Conductive powder coated with nickel on nonconductive polymer particle surface
Application
- Conductive Adhesive
- Conductive Gasket
- EMI Shielidng Paint
Specification
- Good conducivity
- High Reliability
- Low density
Properties
Product name | Particle shape | Particle size (D50, ㎛) |
Tap dinsity (g/cc) |
Ni coating contents (%) |
---|---|---|---|---|
EN-NPH300 | Hollow | 32±5 | 0.2~0.4 | 20~40 |
EN-NPH600 | Hollow | 65±10 | 0.2~0.4 | 20~40 |
EN-NPP050 | Filled | 7±1 | 0.9~1.1 | 60~80 |
EN-NPP100 | Filled | 10±2 | 0.9~1.1 | 60~80 |
EN-NPP200 | Filled | 20±2 | 0.9~1.1 | 60~80 |
* 1) Tap density : According to Ni contensts and particle size * 2) Ag contents : Accoding to customer request