Exinno

  • Overview
  • Business Areas
  • Location

EXINNO Inc. brings organic materials such as electronic materials, Oligomers, and Monomers to organic and inorganic composite materials such as conductive powders, functional pastes, and functional films. We pursue high-tech future industry companies ranging from development to commercialization and sales according to customer requirements.

  • Company Name

    EXINNO Ltd.

  • Foundation

    March 2019

  • Business Areas

    Thermosetting material

  • Headquarters

    10F, Serveone, 2621 Nambusunwhan-ro, Gangnam-gu, Seoul, 06267, Korea

  • R&D Center

    175, Suworam 4-gil, Seotan-myeon, Pyeongtaek-si, Gyeonggi-do, Republic of Korea

  • TEL

    +82-31-612-1345

  • FAX

    +82-31-612-1391

  • E-MAIL

    exinno@eltium.co.kr

Category Product Application
Electronic
materials
Functional
Powder
Silver coated copper powder EMI Shielding Film
EMI Shielding Paste
Conductive tape
Paste for electrode
Metal coating polymer powder EMI Shielding Paste
Conductive Paste
Bonding materials for packaging
Functional paste Conductive Paste Circuit printing for RFID Tag, Sensor Antenna
Metal Mesh Paste Electorde of metal mesh touch sensor
Anistropic Conductive Paste Filp Chip bonding, FPCB bonding
EMI Shielding Paste Military display, Chip packing, chip coating
Functional Film EMI Shielding Film Noise suppression of FPC
Conductive Bonding Film Noise suppression and strengthening GND for display, camera module
Polymeric material UV Monomer Acylate Monomer Multyfunctional monomer
UV Curing materials Acylate Monomer UV curable coatings and adhesives
Urethan Acrylate
Epoxy Acrylate
Acryloxyethyl Ester
Silicon Modified Acylate
Fluorine Modified Acrylate
Functional polymer Acrlic Resin PR for PCB
Cycloaliphatic Epoxide Sealant, adhesive
LCD Prisem Coating BLU Prism
Optical Adhesive Optical Adhesive
Electronic materials
Category Product Application
Functional
Powder
Silver coated copper powder EMI Shielding Film
EMI Shielding Paste
Conductive tape
Paste for electrode
Metal coating polymer powder EMI Shielding Paste
Conductive Paste
Bonding materials for packaging
Functional paste Conductive Paste Circuit printing for RFID Tag, Sensor Antenna
Metal Mesh Paste Electorde of metal mesh touch sensor
Anistropic Conductive Paste Filp Chip bonding, FPCB bonding
EMI Shielding Paste Military display, Chip packing, chip coating
Functional Film EMI Shielding Film Noise suppression of FPC
Conductive Bonding Film Noise suppression and strengthening GND for display, camera module
Polymeric material
Category Product Application
UV Monomer Acylate Monomer Multyfunctional monomer
UV Curing materials Acylate Monomer UV curable coatings and adhesives
Urethan Acrylate
Epoxy Acrylate
Acryloxyethyl Ester
Silicon Modified Acylate
Fluorine Modified Acrylate
Functional polymer Acrlic Resin PR for PCB
Cycloaliphatic Epoxide Sealant, adhesive
LCD Prisem Coating BLU Prism
Optical Adhesive Optical Adhesive

Headquarters

  • Address

    10F, 2621, Nambusunhwan-ro, Gangnam-gu, Seoul, Korea

  • Tel

    +82-31-612-1345

  • Fax

    +82-31-612-1391

R&D Center

  • Address

    175, Suworam 4-gil, Seotan-myeon, Pyeongtaek-si, Gyeonggi-do, Republic of Korea