Electronic Material

Silver coated Copper powder

Conductive powder coated with Ag with excellent anti-oxyditation and conductivity on surface of Cu powder

Application
  • EMI Sheilding Mateilals (Film & Paste)
  • Conductive Paste
  • Instead of Ag powder
Specification
  • Excllent Conductivtiy
  • High Reliability
  • Uniform Dispersion
Properties
Product name Particle shape Particle size
(D50, ㎛)
Tap dinsity
(g/cc)
Ag coating contents
(%)
EN-SCD050 Dendrite 5.0±1.0 1.0~2.0 5~10
EN-SCD080 Dendrite 7.5±2.0 1.0~2.0 5~10
EN-SCD120 Dendrite 12.0±2.0 1.0~2.0 5~10

* 1) Tap density : According to Ag contensts and particle size * 2) Ag contents : Accoding to customer request

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Nickel coated Polymer powder

Conductive powder coated with nickel on nonconductive polymer particle surface

Application
  • Conductive Adhesive
  • Conductive Gasket
  • EMI Shielidng Paint
Specification
  • Good conducivity
  • High Reliability
  • Low density
Properties
Product name Particle shape Particle size
(D50, ㎛)
Tap dinsity
(g/cc)
Ni coating contents
(%)
EN-NPH300 Hollow 32±5 0.2~0.4 20~40
EN-NPH600 Hollow 65±10 0.2~0.4 20~40
EN-NPP050 Filled 7±1 0.9~1.1 60~80
EN-NPP100 Filled 10±2 0.9~1.1 60~80
EN-NPP200 Filled 20±2 0.9~1.1 60~80

* 1) Tap density : According to Ni contensts and particle size * 2) Ag contents : Accoding to customer request

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